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| MM74HC175 Quad D-Type Flip-Flop With Clear September 1983 Revised February 1999 MM74HC175 Quad D-Type Flip-Flop With Clear General Description The MM74HC175 high speed D-type flip-flop with complementary outputs utilizes advanced silicon-gate CMOS technology to achieve the high noise immunity and low power consumption of standard CMOS integrated circuits, along with the ability to drive 10 LS-TTL loads. Information at the D inputs of the MM74HC175 is transferred to the Q and Q outputs on the positive going edge of the clock pulse. Both true and complement outputs from each flip flop are externally available. All four flip-flops are controlled by a common clock and a common CLEAR. Clearing is accomplished by a negative pulse at the CLEAR input. All four Q outputs are cleared to a logical "0" and all four Q outputs to a logical "1." The 74HC logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Features s Typical propagation delay: 15 ns s Wide operating supply voltage range: 2-6V s Low input current: 1 A maximum s Low quiescent supply current: 80 A maximum (74HC) s High output drive current: 4 mA minimum (74HC) Ordering Code: Order Number MM74HC175M MM74HC175SJ MM74HC175MTC MM74HC175N Package Number M16A M16D MTC16 N16E Package Description 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Devices also available in Tape and Reel. Specify by appending the suffix letter "X" to the ordering code. Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Truth Table (Each Flip-Flop) Inputs Outputs Clear L H H H Clock X L D X H L X Q L H L Q0 Q H L H Q0 H = HIGH Level (steady state) L = LOW Level (steady state) X = Irrelevant = Transition from LOW-to-HIGH level Q0 = The level of Q before the indicated steady-state input conditions were established Top View (c) 1999 Fairchild Semiconductor Corporation DS005319.prf www.fairchildsemi.com MM74HC175 Logic Diagram www.fairchildsemi.com 2 MM74HC175 Absolute Maximum Ratings(Note 1) (Note 2) Supply Voltage (VCC) DC Input Voltage (VIN) DC Output Voltage (VOUT) Clamp Diode Current (IIK, IOK) DC Output Current, per pin (IOUT) DC VCC or GND Current, per pin (ICC) Storage Temperature Range (TSTG) Power Dissipation (PD) (Note 3) S.O. Package only Lead Temperature (TL) (Soldering 10 seconds) 260C 600 mW 500 mW -0.5 to +7.0V -1.5 to VCC +1.5V -0.5 to VCC +0.5V 20 mA 25 mA 50 mA -65C to +150C Recommended Operating Conditions Min Supply Voltage (VCC) DC Input or Output Voltage (VIN,VOUT) Operating Temperature Range (TA) Input Rise or Fall Times (tr, tf) VCC = 2.0V VCC = 4.5V VCC = 6.0V 1000 500 400 ns ns ns 0 -40 VCC +85 V C 2 Max 6 Units V Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur. Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temperature derating -- plastic "N" package: - 12 mW/C from 65C to 85C. DC Electrical Characteristics Symbol VIH Parameter Minimum HIGH Level Input Voltage VIL Maximum LOW Level Input Voltage VOH Minimum HIGH Level Output Voltage VIN = VIH or VIL |IOUT| 20 A Conditions (Note 4) VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0 4.5 6.0 4.2 5.7 0 0 0 0.2 0.2 TA = 25C Typ 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.1 8 TA = -40 to 85C TA = -55 to 125C Guaranteed Limits 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.84 5.34 0.1 0.1 0.1 0.33 0.33 1.0 80 1.5 3.15 4.2 0.5 1.35 1.8 1.9 4.4 5.9 3.7 5.2 0.1 0.1 0.1 0.4 0.4 1.0 160 Units V V V V V V V V V V V V V V V V A A VIN = VIH or VIL |IOUT| 4.0 mA |IOUT| 5.2 mA VOL Maximum LOW Level Output Voltage VIN = VIH or VIL |IOUT| 20 A 2.0V 4.5V 6.0V VIN = VIH or VIL |IOUT| 4.0 mA |IOUT| 5.2 mA IIN ICC Maximum Input Current Maximum Quiescent Supply Current VIN = VCC or GND IOUT = 0 A 6.0V VIN = VCC or GND 4.5V 6.0V 6.0V 4.5V 6.0V Note 4: For a power supply of 5V 10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. 3 www.fairchildsemi.com MM74HC175 AC Electrical Characteristics VCC = 5V, TA = 25C, CL = 15 pF, tr = tf = 6 ns Symbol fMAX tPHL, tPLH tPHL, tPLH tREC tS tH tW Parameter Maximum Operating Frequency Maximum Propagation Delay, Clock to Q or Q Maximum Propagation Delay, Reset to Q or Q Minimum Removal Time, Clear to Clock Minimum Setup Time, Data to Clock Minimum Hold Time, Data from Clock Minimum Pulse Width, Clock or Clear 10 20 0 16 ns ns ns 20 ns 13 21 ns 15 25 ns Conditions Typ 60 Guaranteed Limit 35 Units MHz AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50 pF, tr = tf = 6 ns (unless otherwise specified) Symbol fMAX Parameter Maximum Operating Frequency tPHL, tPLH Maximum Propagation Delay, Clock to Q or Q tPHL, tPLH Maximum Propagation Delay, Reset to Q or Q tREM Minimum Removal Time Clear to Clock tS Minimum Setup Time Data to Clock tH Minimum Hold Time Data from Clock tW Minimum Pulse Width Clear or Clock tr , tf Maximum Input Rise and Fall Time tTLH, tTHL Maximum Output Rise and Fall Time CPD CIN Power Dissipation Capacitance (Note 5) Maximum Input Capacitance Note 5: CPD determines the no load dynamic power consumption, PD=CPD VCC2f+ICC VCC, and the no load dynamic current consumption, IS=CPD VCC f+ICC. Conditions VCC 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V 2.0V 4.5V 6.0V TA = 25C Typ 12 60 70 80 15 13 64 14 12 6 30 35 150 30 26 125 25 21 100 20 17 100 20 17 0 0 0 30 9 8 80 16 14 1000 500 400 30 9 8 150 5 10 75 15 13 TA = -40 to 85C TA = -55 to 125C Guaranteed Limits 5 24 28 190 38 32 158 32 27 125 25 21 125 25 21 0 0 0 100 20 17 1000 500 400 95 19 16 4 20 24 225 45 38 186 37 32 150 30 25 150 30 25 0 0 0 120 24 20 1000 500 400 110 22 19 Units MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns pF (per package) 10 10 pF www.fairchildsemi.com 4 MM74HC175 Physical Dimensions inches (millimeters) unless otherwise noted 16-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package Number M16A 16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package Number M16D 5 www.fairchildsemi.com MM74HC175 Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package Number MTC16 www.fairchildsemi.com 6 MM74HC175 Quad D-Type Flip-Flop With Clear Physical Dimensions inches (millimeters) unless otherwise noted (Continued) 16-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package Number N16E LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component in any component of a life support 1. Life support devices or systems are devices or systems device or system whose failure to perform can be reawhich, (a) are intended for surgical implant into the sonably expected to cause the failure of the life support body, or (b) support or sustain life, and (c) whose failure device or system, or to affect its safety or effectiveness. to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the www.fairchildsemi.com user. Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications. |
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